Copper tungsten heat sink
Tungsten copper heat sink is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.
Advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available properties of WCu and MoCu heat materials
The data of copper tungsten heat sink
Ingredient Name |
CAS Number |
% Weight |
| Tungsten | 7440-33-7 | 50-90 |
| Copper | 7440-50-8 | 10-50 |
Composition |
W 90% |
W 88% |
W 85% |
W 80% |
| Density (g/cm3) |
17.0 | 16.6 | 16.4 | 15.5 |
| Coefficient of Thermal Expansion(10-6/K) |
5.6 | 5.7 | 5.8 | 7.0 |
| Thermal Conductivity (W/mK) |
180 | 188 | 196 | 220 |
| Specific Heat Capacity (J/kgK) |
155 | 165 | 175 | 190 |
| Young’s Modulus (Gpa) |
325 | 315 | 305 | 278 |
| Specific Electrical Resistance(uΩm) |
0.047 | 0.045 | 0.042 | 0.035 |
| Vickers Hardness (HV10) |
300 | 295 | 275 | 255 |
Related Links
Copper Molybdenum Heat Sinks
Property Data Sheet of Copper Tungsten Heat Sinks (PDF)
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Email : chinatengsten@gmail.com
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