Molybdenum disc has similar thermal expansion to silicon. They are widely used as contact materials in silicon controlled rectifier’s diodes, transistors and thyristors (GTO’S). Other than in specialist applications, molybdenum is now accepted as the first choice mounting material for power semiconductor devices due to its significantly lower cost and weight. The fact that both materials have a similar coefficient of expansion to silicon combined with high thermal conductivity makes them an ideal choice, especially in large area power devices where considerable heat is generated. Further applications include the use of molybdenum as heat sink bases in IC’S, LSI’S and hybrid circuits.
THICKNESS |
DIAMETER |
||
mm |
inch |
mm |
inch |
0.1 - 0.3 | 0.004 - 0.012 | 1.0 - 50.0 | 0.040 - 2.0 |
0.31 - 0.5 | 0.012 - 0.020 | 1.0 - 50.0 | 0.040 - 2.0 |
0.51 - 1.0 | 0.020 - 0.040 | 2.0 - 80.0 | 0.080 - 3.2 |
1.1 - 2.0 | 0.040 - 0.080 | 10.0 - 130.0 | 0.40 - 5.2 |
2.1 - 3.0 | 0.080 - 0.120 | 20.0 - 130.0 | 0.80 - 5.2 |
3.1 - 4.0 | 0.120 - 0.160 | 40.0 - 100.0 | 1.60 - 4.0 |
4.1 - 6.0 | 0.160 - 0.240 | 50.0 - 90.0 | 2.0 - 3.6 |
Grade |
Mo-1 |
Mo-2 |
Mo-3 |
|
Mo(%)≥ | 99.95 | 99.95 | 99.92 | |
Other Element Cont (%)≤ | Pb | 0.001 | ||
Bi | 0.001 | |||
Sn | 0.001 | |||
Sd | 0.001 | |||
Cd | 0.001 | |||
Fe | 0.005 | 0.006 | 0.030 | |
Ni | 0.002 | 0.001 | 0.005 | |
Al | 0.002 | 0.002 | 0.005 | |
Si | 0.003 | 0.001 | 0.010 | |
Ca | 0.002 | 0.002 | 0.004 | |
Mg | 0.001 | 0.001 | 0.003 | |
P | 0.001 | 0.001 | 0.002 | |
C | 0.005 | 0.003 | 0.010 | |
O | 0.003 | 0.005 | 0.008 | |
N | 0.001 | 0.001 |
Note: We can also produce molybdenum square and different shapes of molybdenum slice according to customers’ requirement and drawing.
Copper Molybdenum Heat Sinks
Material Safety Data Sheet of Pure Molybdenum
Material Safety Data Sheet of Pure Molybdenum (PDF)
Catalog of Pure Molybdenum Products (PDF)